copper foil
英 [ˈkɒpə(r) fɔɪl]
美 [ˈkɑːpər fɔɪl]
铜箔
双语例句
- This article mainly introduces the copper foil fabrication equipment history and the developmental direction for the future.
文章重点介绍电解铜箔设备的发展历史及未来的发展趋势。 - Copper and plastic compounds and mixtures of copper and plastic separation: such as electronic circuit board copper foil recycling, waste plastic recycling copper and copper wire.
铜和塑料复合物及铜和塑料混合物分离：如电子线路板覆铜铜箔的回收，废旧铜线铜和塑料的回收。 - The metal conducting layer coating the two insulation layers of the copper core wires can be a layer of copper foil or a layer of a tin foil or a layer of aluminum foil;
所述包覆在其中两个铜芯线绝缘层外面的金属导电层可以是一层铜箔或一层锡箔或一层铝箔； - The PI Control of Winding in Copper Foil Production Based on PLC
利用PLC实现铜箔收卷的PI控制 - This paper introduces new technical achievement for waster water reutilization in electrodeposited copper foil production process.
文章介绍了在电解铜箔的生长过程中所产生的废水回收再利用的新技术成果。 - Application and Development of HDI Multi-layer Laminated Copper Foil Production Technology Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
HDI多层板覆铜箔板生产技术的应用与开发GB/T16317-1996多层印制电路用限定燃烧性的薄覆铜箔聚酰亚胺玻璃布层压板 - Copper Plating: Copper is electrodeposited onto the copper foil that is outlined by the dry film.
镀铜：图形转移完成后将进行图形电镀。 - Through precise control of welding process parameters, one-side welding enameled wire to copper foil is realized.
通过对焊接工艺参数进行精密控制，实现了铜箔漆包线的单面直接焊接。 - The paper dynamically analyses copper Foil tension of the Crude Foil Engine in the copper Foil production progress.
对生箔机在铜箔生产过程中的铜箔张力进行动态分析，揭示出转矩、铜箔张力、实时卷绕半径之间的关系。 - The results indicate that the reducing reaction of electrolyte on the foil with rough surface is much visible than on that with shiny surface, the dissolution potential of matte copper foil is0.
结果表明，电解液在毛面铜箔表面发生还原反应的程度比在光面铜箔表面显著，其阳极溶解电位比光面铜箔约低0。 - Firstly, load and demands analysis is completed, taking a copper foil factory as an example.
文章首先以某铜箔厂为对象，对企业负荷和电能质量补偿要求进行了分析。 - Tiffany crafted his lamps using the Copper Foil method.
蒂芙尼巧妙地灯用铜箔的方法。 - The control of tension upon rolling-up in copper foil production;
论文具体针对凹板印刷机的收放卷张力控制展开讨论。 - Electroless nickel plating on PCB copper foil catalyzed by zinc solution;
该锌-镍合金作为印制板用压延铜箔的阻挡层。 - In spot welding of enameled wire to copper foil, selecting the appropriate welding electrodes and controlling the welding energy precisely are very important.
在铜箔漆包线的点焊中，选取合适的焊接电极和焊接能量进行精密控制非常重要。 - So to produce the suitable low profile electronic copper foil for high density circuit board ( HDI) is more difficult and pressing.
要生产出适合于高密度电路板（HDI）使用的低轮廓电子铜箔更加困难和紧迫。 - An Analysis of Electrodeposited Copper Foil Peel Strength Performance Factors& Solutions
浅析影响电解铜箔抗剥离强度的因素及对策 - Design of the Control System Based on PLC and Touch Screen for the Post-processor of Copper Foil
基于PLC和触摸屏的铜箔后处理机控制系统设计 - A Tiffany style lamp will be recognized by the distinctive stained glass shade, made with pieces of stained glass soldered together using copper foil.
蒂凡尼款式的灯被认可，与众不同的彩色玻璃灯罩，使用铜箔与彩色玻璃的展品焊接在一起。 - The electrolytic copper foil production for printed circuit board in the world has experienced almost fifty years.
印制电路板用电解铜箔产品在世界上已经历了近五十年的发展历程。 - This is a piece of copper foil 20cm square that has 696 rings, a portion of which is reproduced above.
这是一片20厘米见方的铜箔，上有696个同心圆环，题图即是它的部分示意图。 - The permeation prevention with the copper foil has been done in the process of boronizing through the experiment.
通过试验研究了铜箔（copperfoil）在渗硼处理中的防渗作用。 - Research of galvanized process of electrolytic copper foil
电解铜箔镀锌工艺的研究 - Study on Nickel Plating Treatment and Performances of Electrolytic Copper Foil
电解铜箔镀镍处理及其性能的研究 - After the plating, corrosion resistance, heat resistance and binding strength of electrolyte copper foil were improved.
经过处理后的电解铜箔耐蚀性、耐热性和粘合强度等性能指标均有明显提高。 - The synthesis of the adhesive, coating on copper foil, production process of laminate are also discussed.
研究了胶粘剂的合成、铜箔涂胶及层压板制造等工艺。 - Peeling strength is an important indicator of bonding between copper foil and resin.
剥离强度是衡量铜箔与树脂结合力的重要指标。 - But excess PEG will reduce the tensile strength and elongation of copper foil at high temperature.
同时能光滑尖锥状晶粒的峰尖，避免粗糙过度，但PEG过量会降低铜箔高温抗拉强度和延伸率。 - And the LiPF4C2O4/ carbonates electrolyte also shows wide electrochemical window on aluminum and copper foil electrodes.
铜箔和铝箔集流体在其碳酸酯电解液体系中也具有较好的电化学稳定性、较宽的电化学窗口。